High-speed printed circuit board
20 layers

high-speed printed circuit board
high-speed printed circuit board
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Characteristics

Options
high-speed
Number of layers
20 layers

Description

Applications Server field Features High speed material + back drill Material TU-872 Thickness 5.0±0.5m m Min Hole Size / Min Track/Spacingh 75/75um Minimum board thickness and hole ratio 12:1

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Exhibitions

Meet this supplier at the following exhibition(s):

WOTS-World of Technology and Science

24-28 Sep 2024 Utrecht (Netherlands) Hall 9B090

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    Hong Kong Electronics Fair (Autumn Edition)

    13-16 Oct 2024 Hong Kong (Hong Kong, China)

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.