18 layer printed circuit board

18 layer printed circuit board
18 layer printed circuit board
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Characteristics

Number of layers
18 layer

Description

Applications Chip testing field Features 3 times laser drilling, 4 times pressing Material S1000-2M Thickness 2.1±0.21mm Min Hole Size / Min Track/Spacingh 75/75um Minimum board thickness and hole ratio 11:1

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Exhibitions

Meet this supplier at the following exhibition(s):

WOTS-World of Technology and Science

24-28 Sep 2024 Utrecht (Netherlands) Hall 9B090

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    Hong Kong Electronics Fair (Autumn Edition)

    13-16 Oct 2024 Hong Kong (Hong Kong, China)

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.