Applications
Chip testing field
Features
3 times laser drilling, 4 times pressing
Material
S1000-2M
Thickness
2.1±0.21mm
Min Hole Size
/
Min Track/Spacingh
75/75um
Minimum board thickness and hole ratio
11:1
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.