Fiber laser marking machine PE-20W/50W (II)

metalaluminumceramic

Perfect Laser launched the latest Full-enclosed Type Fiber laser silicon wafer cutting machine with Dust-proof PE-20W/50W (II), the biggest difference between the first generation is that this laser scribe machine is fully enclosed design, machine with dust cover, can avoid environmental pollution, to prevent the operator's vision damage. High output power, high precision scribing, fast speed and could cut curve and straight line graph. Adopting fiber laser as work light source, the two-dimensional work table of the laser scribe machine is controlled by computer, and could do kinds of movement according to what graphics be input in. Mainly used for germanium and silicon,gallium arsenide,metal and other semiconductor material substrate cutting and scribing , machinable aluminum foil,silicon, solar panels, ceramic , etc., the workpiece is fine and beautiful with smooth cutting edges. 1.This silicon wafer cutting machine is fully enclosed design, with dust cover, it can avoid environmental pollution, to prevent the operator's vision damage. 2.Software upgrade: the solar cell laser scribing machine support the arc interpolation,circular arc cutting more smoothly. 3.The silicon wafer cutting machine upgrade: covers an area of space smaller after modification, operating more accord with human body engineering. 4.Refactoring workbench processing part, open-type workbench processing area, up-down material more convenient. Removed spare parts from the workbench tablet, higher precision and not easy to deformation. 5. Improvement the screw parts of solar cell laser scribing machine: screw lead increased, so as to expedite the processing speed, guarantee machining accuracy.