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Electrolytic copper plating steelaluminumbrass
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Characteristics
- Type
- electrolytic
- Substrate
- steel, aluminum, brass, copper, stainless steel, bronze
- Certifications
- AMS 2418H
Description
Copper Plating is electrolytic plating that deposits a layer of copper onto the substrate. This process is typically used to provide an anti-seize surface, as a mask to prevent carburizing on surfaces during heat treating, and to enhance solderability. Copper plating can be used as an under plate for difficult to plate alloys as well as electromagnetic shielding.
Standard Specifications
RoHS, REACH, ELV & WEEE Compliant
Performance Benefits
Good Solderability
Excellent Conductivity
Good corrosion when used as undercoat
Inhibits electromagnetic interference with thickness of 1 mil of plating
Throws very well
Thickness
.0001"-.001"
100-1000 uin.
Max Part Size
24" x 20" x 12"
35 pounds per part
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.