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Electrolytic gold plating
stainless steelaluminumbronze

electrolytic gold plating
electrolytic gold plating
electrolytic gold plating
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Characteristics

Type
electrolytic
Substrate
stainless steel, aluminum, bronze, copper, steel, brass
Certifications
AMS 2422, ASTM B488, MIL-DTL-45204

Description

Gold plating is an electrolytic plating process that deposits gold onto a substrate. Gold plating is often used in the electronics industry for its conductivity and long term corrosion resistance. Gold Plating Types Type I Hard Gold 99.7% gold purity, Hardness 130-200HK Type II Hard Gold 99.0% gold purity, Hardness 130-200HK Type III Soft Gold 99.9% gold purity, 90 HK max Code A: 90 HK25 Code C: 130-200 HK25 Applications Type I High reliable electrical contacts Type II Wear resistance (hard) and cosmetic jewelry Type III Semiconductor Components, Nuclear Engineering, Thermosonic Bonding, Ultrasonic Bonding, Solderability, High Temperature Exposure Standard Specifications RoHS, REACH, ELV & WEEE Compliant Performance Benefits Corrosion Resistance Heat Resistance for Type III Hard Gold used for some wear resistance/functional properties Excellent Solderability Conductive Plating Cosmetic/Jewelry/Bright Finish Gold contacts should not be mated to tin contacts Thickness .00001-.0001" 10-100 uin. Max Part Size Hard Gold= 12" x 12" x 12" Soft Gold= 12" x 12" x 6" All parts must weigh 35 lbs or less
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.