Gold plating is an electrolytic plating process that deposits gold onto a substrate. Gold plating is often used in the electronics industry for its conductivity and long term corrosion resistance.
Gold Plating Types
Type I Hard Gold 99.7% gold purity, Hardness 130-200HK
Type II Hard Gold 99.0% gold purity, Hardness 130-200HK
Type III Soft Gold 99.9% gold purity, 90 HK max
Code A: 90 HK25
Code C: 130-200 HK25
Applications
Type I High reliable electrical contacts
Type II Wear resistance (hard) and cosmetic jewelry
Type III Semiconductor Components, Nuclear Engineering, Thermosonic Bonding, Ultrasonic Bonding, Solderability, High Temperature Exposure
Standard Specifications
RoHS, REACH, ELV & WEEE Compliant
Performance Benefits
Corrosion Resistance
Heat Resistance for Type III
Hard Gold used for some wear resistance/functional properties
Excellent Solderability
Conductive Plating
Cosmetic/Jewelry/Bright Finish
Gold contacts should not be mated to tin contacts
Thickness
.00001-.0001"
10-100 uin.
Max Part Size
Hard Gold= 12" x 12" x 12"
Soft Gold= 12" x 12" x 6"
All parts must weigh 35 lbs or less