PVD deposition machine PL711

The PL711 is a compact sputter coating unit based on HiPIMS technology (High Power Impulse Magnetron Sputtering). It has two planar HiPIMS cathodes and allows to deposit selected nitride and carbon coatings (DLC2, DLC3) using highly productive processes. The dense plasma with high ionization in the carousel produces homogeneous coatings and a high deposition rate. Coatings from PL711 provide excellent smooth surfaces while maintaining high density, hardness and outstanding adhesion. Technology A PL711 coating unit uses 2 planar sputtering cathodes with HiPIMS technology. Etching processes Several etching technologies can be used in the PLATIT PL711 coating unit, offering various advantages: LGD® (Lateral Glow Discharge) Plasma etching with argon, glow discharge Metal ion etching (Ti, Cr) Deposition types Sputter nitride coatings Reactive and non-reactive processes Targets: Ti, Cr Coating temperature up to 350°C Sputter Cr and PECVD a-C:H:Si DLC2 (PECVD coating) Targets: Cr Coating temperature 180-220°C Load and cycle times Coating volume: max. ø600 x H805mm Coating height with defined coating thickness: max. 500mm Load: max. 250kg, higher weight upon request Batches/day: 2 Modular carousel systems 3 axes or 6 axes or 9 axes Software PLATIT SmartSoftware (PC and PLC system) Easy operation and maintenance Modern user interface with menu navigation on touch screen Real-time process visualization incl. data recording and data management Manual and automatic process control Remote diagnosis and maintenance possible