CO2 laser cutting system ProVia FP-UC

UV laserpanelwith programming software

ProVia systems are advanced volume production workstations for rigid, rigid-flex or flex panels, incorporating high performance beam positioning and laser control for high throughput drilling and routing of complex features. Choose from Dual-laser (UV + CO2), UV, and CO2 lasers models Dual or single laser systems Single-laser systems available in dual-head, dual-panel processing configurations All systems are roll-to-roll compatible Standard or compact automation available CO2 laser systems are appropriate for high speed drilling, cutting and skiving of dielectrics, while UV laser systems are able to drill and pattern copper and can provide higher process quality in many dielectrics. Whether your application is with glass or organic reinforced epoxies or non-reinforced materials (resin-coated foil or polyimide), there is a ProVia model to meet your requirements. ProVia FP-UC Dual Laser Drilling System ProVia FP-UC laser drilling and cutting systems incorporate both UV and CO2 lasers and scan heads. The CO2 laser is appropriate for high speed drilling, cutting and skiving of dielectrics, while the UV laser is able to machine copper and provide higher process quality in many dielectrics. Combining both laser sources (UV + CO2) into one system allows a simple, reliable process with a large process window Openings in the top copper with high accuracy using the UV laser CO2 lasers remove the dielelectric without damage to the top or bottom copper surfaces Each process step may be optimized independently Multistep processing allows automatic drilling of two-layer vias