Diamond wire cutting machine DW 292-300
multi-wirefor monocrystalline siliconblocks

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Characteristics

Technology: diamond wire, multi-wire
Material: for monocrystalline silicon
Product handled: blocks, wafer
Control type: NC
Applications: for the semiconductor industry
Configuration: compact
Other characteristics: high-speed
Maximum cutting height: 305 mm
(12 in)
Tube diameter: 305 mm
(12 in)
Cutting speed: 20 m/s, 35 m/s
(65.617 ft/s, 114.829 ft/s)
Acceleration: 8 m/s², 12 m/s²
(26 ft/s², 39 ft/s²)
Overall length: 3,610 mm
(142 in)
Overall width: 1,380 mm
(54 in)
Height: 2,860 mm
(113 in)
Weight: 9,300 kg
(20,502.99 lb)

Description

The DW292-300 is specifically designed for slicing monocrystalline silicon blocks with up to 300mm diameter into high quality wafers for the semiconductor industry. The new developed DW292-300 is capable to be run with slurry as well as diamond wire and includes sophisticated features to improve wafer quality such as warp and waviness Longer wire web length as well as higher wire speed and wire acceleration enable an increased throughput per machine and year. Usage of very thin diamond wire is possible as a result of optimized inertia of moving parts, less deflection rollers and shorter wire path. The DW292-300 is highly insensitive to temperature fluctuation and vibrations due to its compact and robust mineral cast frame and rigid design. Operation is safer, easier and faster thanks to higher process automation and new intuitive HMI with dialog-based production assistant. Your benefits: High quality wafer Increased throughput Robustness and durability Higher process automation Easy and safe operation