Smallest 3D coil in the market epoxy encapsulated. Newer designs in KES and mobile applications require smallest sizes in this passive component and still a long reading distance together with higher reliability. 3DC06EM offer upgraded possibilities due to the extra protection that the Epoxy molding gives.
Characteristics
- Size 7.9x7.9x2.45 mm
- SMD solution
- Suitable for AOI
- High stability in temperature (-40 ºC to +85 ºC)
- P&P operations allowed
- Same sensitivity in the three axi
125 kHz / 3.45mH / 7.9x7.9x2.45 mm
3DC06EM-S0345J is customizable.
Suitable for: KES
SMD solution
Suitable for AOI
High stability in temperature (-40 ºC to +85 ºC)
P&P operations allowed
Same sensitivity in the three axis.
RoHs compliant
AEC-Q200
s.