Semiconductor packaging

for cameras

Small, smaller, smallest. Our packaging knowledge allows solutions for the most challenging integration of semiconductor components. Optimized for performance & cost for series production. Our design and production capabilities include solutions for the smallest formfactor and complex optical assemblies for imaging and photonics systems. These optoelectronic systems require critical assembly steps to reach maximum optical, as well as electrical performance. These assemblies can require chip-on-board, wirebonding, gluing, and placement steps for individual components such as extremely large imagers, mirrors, prisms, filters and fiber optic plates. At Prodrive, we have the capabilities to design sophisticated custom optical components. This can be applied for comprehensive illuminators with specific beam shaping capabilities or in other applications requiring high resolution color accurate lens assemblies for imagers. Regardless of your requirements we can go from concept to design and finally to series with highest quality with our automated production capabilities. Application and solutions include: -Metrology -Microscopy -Life science imaging -Automotive sensors -Custom image cameras -Custom lens assemblies -Chip-on-board Optimize for Industrial Level Production Assembly Process Development Die Attached & Wirebonding Ultra-High Vacuum Compatibility Communication Interfaces We offer several communication options, tailored to customer needs. Resolution Offering several options regarding the sharpness and clarity of pictures and images. White Labeling Customer specific branding is possible, to align within customer product portfolio.