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Grinding polishing machine GC-GP850

grinding polishing machine
grinding polishing machine
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Go to the Qingdao Gaoce Technology Co., Ltd. website for more information

Description

• Machine profile - Overall dimension: ~5400(L)x3000(W)x2400(H)mm Machine weight: - ~12000kg • Silicon rod spécification - Processing margin: 156.00~D168.00mm (Before) / 156.00-D165.60mm (After) Processing diameter: 208~250mm / 02OO~0242mm • Technical Parameters - Processing chamfered/arc: C0.2~C10mm/R2~R10 Processing margin tolérance: ±0.05mm Processing chamfered/diameter tolérance: ±0.05mm Four intersection angle: 90° ± 0.04° Surface roughness: Ra<0.1pm Arc surface roughness: Ra<0.2pm Arc length projection tolérance: ±0.2mm
Go to the Qingdao Gaoce Technology Co., Ltd. website for more information

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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