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Monocrystalline silicon cutting machine Mono802S
diamond wirebladefor industrial applications

monocrystalline silicon cutting machine
monocrystalline silicon cutting machine
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Characteristics

Technology
blade, diamond wire
Material
for monocrystalline silicon
Applications
for industrial applications
Other characteristics
high-precision, high-efficiency
Tube diameter

Min.: 200 mm
(8 in)

Max.: 300 mm
(12 in)

Cutting speed

Min.: 0 m/s
(0 ft/s)

Max.: 30 m/s
(98.425 ft/s)

Overall length

5,200 mm
(205 in)

Overall width

3,800 mm
(150 in)

Height

2,400 mm
(94 in)

Weight

8,000 kg
(17,636.98 lb)

Description

This equipment is used for machining Mono-silicon bars. Cropping and sampling the hard and brittle materials through electroplated diamond wire with feeding process. It is a reliable, high-efficient and high precision equipment. Equipment characteristics: •Bar Length: 6500mm (Max.) •1 blade per time •Cutting duration: 8 minutes Equipment advantage: •Low cutting loss •High efficiency •Reliable performance
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.