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Diamond wire cutting machine Poly306
for monocrystalline siliconfor industrial applicationsautomated loading/unloading

diamond wire cutting machine
diamond wire cutting machine
diamond wire cutting machine
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Characteristics

Technology
diamond wire
Material
for monocrystalline silicon
Applications
for industrial applications
Workpiece loading
automated loading/unloading
Other characteristics
automatic
Cutting speed

Max.: 25 m/s
(82.021 ft/s)

Min.: 0 m/s
(0 ft/s)

Overall length

3,400 mm
(134 in)

Overall width

2,300 mm
(91 in)

Height

1,900 mm
(75 in)

Weight

6,000 kg
(13,227.74 lb)

Description

The product named Poly306 Diamond Wire Multi-silicon Cutting Machine is a machine using a diamond wire to cut and process muiti-silicon brick. It employs a processing technique in which silicon bricks are cut into sections through a diamond wire reciprocating at high speed. This machine is mainly used for processing multi-silicon , can simultaneously cut several bricks and is a new machine with reliable functionality, high cutting efficiency and high processing accuracy,low footprint.,convenient in operation, and also can be configured with machine hand to reduce workload or can be configured with robot for automatic production line.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.