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Profiling grinding polishing machine GC - GP450

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Go to the Qingdao Gaoce Technology Co., Ltd. website for more information

Characteristics

Associated function: profiling

Description

• Machine profile - Overall dimension: ~4200(L)x2800(W)x2100(H)mm Machine weight: - ~8000kg • Silicon rod spécification - Processing margin: 156.00~D168.00mm (Before) / 156.00-D165.60mm (After) Processing diameter: CO.2 ~ C10mm • Technical Parameters - Processing margin tolérance: ±0.05mm Four intersection angle: 90° ± 0.08° Surface roughness: Ra<0.15pm

Go to the Qingdao Gaoce Technology Co., Ltd. website for more information

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.

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