Chamfering grinding polishing machine GC-KM202

edge

The product can be used in many links of silicon wafer manufacturing process, including the squaring, chamfering, grinding, and polishing. The silicon rods can be loaded and clamped in one step. Via accurate positioning of the high precision turntable in the circulation of operation stations, all processing links can be completed, positioned precisely by the high precision turntable during process to complete all steps, 0.2mm square margin of single edge, minimizing silicon loss.