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Cutting machine for the semiconductor industry GC-SEDW812diamond wirefor monocrystalline siliconbar
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Characteristics
- Technology
- diamond wire
- Material
- for monocrystalline silicon
- Product handled
- bar
- Applications
- for industrial applications, for the semiconductor industry
- Tube diameter
301 mm
(12 in)- Cutting speed
2,100 m/min
- Overall length
5,400 mm
(213 in)- Overall width
2,200 mm
(87 in)- Height
3,000 mm
(118 in)- Weight
14,000 kg
(30,864.72 lb)
Description
The product is a special processing equipment that USES diamond wire to cut semiconductor single crystal silicon sheet. It can process silicon rod diameter compatible with 8 、“12" and the maximum processing length 450mm (crystal deviation Angle ≤4°). It has the characteristics of small silicon material loss, good processing quality, high cutting efficiency and good stability.
Other Qingdao Gaoce Technology Co., Ltd. products
Semiconductor Cutting Equipment
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.