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Cutting machine for the semiconductor industry GC-SEWS824diamond wirefor monocrystalline siliconsample
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Characteristics
- Technology
- diamond wire
- Material
- for monocrystalline silicon
- Product handled
- sample, bar
- Applications
- for industrial applications, for the semiconductor industry
- Cutting speed
Min.: 0 mm/min
(0 in/s)Max.: 900 mm/min
(0.591 in/s)- Overall length
5,000 mm
(197 in)- Overall width
2,560 mm
(101 in)- Height
2,740 mm
(108 in)- Weight
5,500 kg
(12,125.42 lb)- Power supply
380 V
Description
This is a special processing equipment for cutting semiconductor monocrystalline silicon rod. The diameter of silicon rod that can be processed is 8-24 inches, and the maximum processing length is 2600mm. The equipment adopts diamond wire cutting, which can realize the functions of cropping, head/tail removal and sample cutting, etc. with the features of high cutting efficiency and good section quality.
Other Qingdao Gaoce Technology Co., Ltd. products
Semiconductor Cutting Equipment
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.