- Production Machines
- Cutting Machine
- Diamond wire cutting machine
- Qingdao Gaoce Technology Co., Ltd.
- Products
- Catalogs
- News & Trends
- Exhibitions
Cutting machine for the semiconductor industry GC-SEDW812Adiamond wirefor monocrystalline siliconwafer
Add to favorites
Compare this product
Characteristics
- Technology
- diamond wire
- Material
- for monocrystalline silicon
- Product handled
- wafer
- Applications
- for the semiconductor industry
- Tube diameter
201 mm
(8 in)- Cutting speed
Min.: 0 mm/min
(0 in/s)Max.: 3 mm/min
(0.002 in/s)- Overall length
5,400 mm
(213 in)- Overall width
2,100 mm
(83 in)- Height
3,100 mm
(122 in)- Weight
14,000 kg
(30,864.72 lb)
Description
The is a special processing equipment where the diamond wire is used to cut semiconductor monocrystalline silicon and produce silicon wafers; it can process the silicon rods with diameter of 6 inches and 8 inches; the maximum processing length is 450mm (crystallographic orientation angle ≤1°). It is characterized with small silicon material loss, good processing quality, high cutting efficiency and good stability, etc.
Other Qingdao Gaoce Technology Co., Ltd. products
Semiconductor Cutting Equipment
Related Searches
- GAOCE cutting machine
- Metal cutting system
- GAOCE cutting machine for industrial applications
- Automatic cutting system
- Knife cutting system
- High-precision cutting system
- High-speed cutting system
- Sheet cutting system
- Stone cutting system
- Large-format cutting system
- Sample cutting system
- Modular cutting system
- GAOCE wire cutting machine
- Rotary cutting system
- Bar cutting system
- Roller cutting system
- GAOCE diamond wire cutting machine
- Electrical wire cutting machine
- Vertical blade cutting machine
- Kerf cutting machine
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.