- Machine-tools
- Finishing Machine
- Cutting tool grinding machine
- Qingdao Gaoce Technology Co., Ltd.
- Products
- Catalogs
- News & Trends
- Exhibitions
Cutting tool grinding machine GC-SELA812with rotary tablehydrostatichigh-precision
Add to favorites
Compare this product
Characteristics
- Applications
- cutting tool
- Structure
- with rotary table
- Other characteristics
- high-precision, hydrostatic, double
- Machine weight
28,000 kg
(61,729.43 lb)
Description
This equipment is used in double-sides grinding for semiconductor silicon wafers. 35 pieces of 8-inches silicon wafers or 15 pieces of 12-inches silicon wafers can be placed in one plate. With the hydrostatic rotary table, it is characterized with following advantages like strong bearing capacity, small power loss and long service life, etc.; in addition, its lubricating medium can play roles of vibration damping and error averaging with high precision and good precision assurance.
Other Qingdao Gaoce Technology Co., Ltd. products
Semiconductor Cutting Equipment
Related Searches
- Grinding machine
- Precision grinding machine
- High-precision grinding machine
- Surface treatment wheel
- Tool grinding machine
- Cylindrical grinding wheel
- Grinding polishing machine
- Surfacing wheel
- Hydrostatic grinding machine
- Finishing wheel
- Cutting tool grinding machine
- Double grinding machine
- Grinding machine with rotary table
- Tool grinding wheel
- Wafer grinding wheel
- Cutting grinding polishing machine
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.