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Wafer grinding wheel grindingcylindrical
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Characteristics
- Function
- grinding
- Type
- cylindrical
- Other characteristics
- for wafers
- Diameter
150 mm, 202 mm
(5.91 in, 7.95 in)
Description
Grinding Wheels for Chamfering & Grinding of Semiconductor Wafer
It is mainly used in chamfering & grinding for silicon wafers and silicon carbide wafers of various sizes. It is customized to design groove shape and quantity according to customer demand. It is characterized with following features like good shape holding performance, long service life, and defect-free in the processed workpiece.
Other Qingdao Gaoce Technology Co., Ltd. products
Semiconductor Cutting Consumables
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.