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Surfacing wheel cylindrical
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Characteristics
- Function
- grinding
- Type
- cylindrical
- Diameter
350 mm, 400 mm
(13.78 in, 15.75 in)
Description
Grinding Wheels for Cylindrical Grinding of Semiconductor Ingots
t is mainly used in cylindrical grinding for semiconductor silicon rods of various specifications, and it has following features of high-speed and high-efficiency grinding, high processing precision, high material removal rate, and long service life.
Other Qingdao Gaoce Technology Co., Ltd. products
Semiconductor Cutting Consumables
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.