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Finishing wheel cylindrical
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Characteristics
- Function
- finishing
- Type
- cylindrical
- Diameter
Max.: 350 mm
(13.78 in)Min.: 175 mm
(6.89 in)
Description
Semiconductor Thinning Grinding Wheel
It is mainly used in thinning and finishing processing for semiconductor wafer. High speed and high efficiency grinding，high precision，high stock moving and long life span.
Other Qingdao Gaoce Technology Co., Ltd. products
Semiconductor Cutting Consumables
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.