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Diamond wire cutting machine GC-SCDW8300for monocrystalline siliconwaferbar
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Characteristics
- Technology
- diamond wire
- Material
- for monocrystalline silicon
- Product handled
- wafer, bar
- Applications
- for the semiconductor industry
- Tube diameter
Min.: 6 in
Max.: 8 in
- Overall length
4,880 mm
(192 in)- Overall width
2,100 mm
(83 in)- Height
3,100 mm
(122 in)- Weight
14,000 kg
(30,864.72 lb)
Description
This product is a special processing equipment that adopts the diamond wire for cutting semiconductor silicon carbide wafers, it can process crystal rod of various diameters, compatible with 6 inches and 8 inches, and the maximum processing length is 300mm. It has following features, small material loss, good processing quality, high cutting efficiency, good stability, etc.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.