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Vertical blade cutting machine GC-MADW 1660
multi-wirefor metalwafer

Vertical blade cutting machine - GC-MADW 1660 - Qingdao Gaoce Technology Co., Ltd. - multi-wire / for metal / wafer
Vertical blade cutting machine - GC-MADW 1660 - Qingdao Gaoce Technology Co., Ltd. - multi-wire / for metal / wafer
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Characteristics

Technology
vertical blade, multi-wire
Material
for metal
Product handled
wafer
Other characteristics
high-precision, modular, roller, kerf
Cutting speed

Min.: 0.1 mm/min
(0 in/s)

Max.: 9 mm/min
(0.006 in/s)

Overall length

3,000 mm
(118 in)

Overall width

1,800 mm
(71 in)

Height

2,900 mm
(114 in)

Weight

10 t
(11.02 us ton)

Description

This is specialized equipment to cut magnetic materials into wafers using wire. It was launched in 2023 and adopts modular and platform design, allowing for dual station operation; independently developed high-precision bearing box, and the maximum cutting speed can reach 2600m/min; advanced tension control algorithm, with tension control accuracy ≤0.5N; thinner wire cutting, lower kerf loss, maximized yield; direct-driven core cutting spindle and take-up and pay-off roller, stable operation; intelligent design, reserved open software interface, meeting the requirements of big data information integration in factories, to achieve intelligent production and refined production control. It is a new type of equipment with reliable functions and higher processing accuracy.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.