Automatic rework station EA-H15

for BGA

● IR infrared reflow soldering system The infrared temperature sensor directly detects the surface temperature of the BGA to achieve true closed-loop control, ensuring an accurate temperature process window and uniform heat distribution. ● PL precise alignment system The high-definition optical chromatic aberration prism alignment system is used to align the solder ball and pad by overlapping; scientific and precise, simple control, and easy to mount and release. ● RPC reflow soldering camera The melting process of the BGA solder ball can be observed from multiple angles from the lateral bearing, providing critical assistance in capturing accurate and reliable process curves. ● BGASOFT control software PC is connected to record, control, and analyze the entire process flow, and generate a temperature curve to meet the process requirements of the modern electronics industry. ● CONTROL BOX operation keyboard Multi-functional operation keyboard makes continuous rework more efficient and simple. IR Infrared Reflow Soldering System Total power 2800 W (Max) Power supply 220V AC 50 Hz Bottom preheating power 400 W *4= 1600 W (dark infrared emitter) 500 W * 4 = 2000 W (high-resolution infrared heating tube optional) Top preheating power 120W*4 = 720 W (infrared heating tube, wavelength: about 2-8 μm) Top heater size range 20 – 60 mm (X, Y directions adjustable) Bottom radiation preheater size 290* 290 mm Max. circuit board size 390* 420 mm Communication USB (can be connected with PC) Temperature measuring sensor Non-contact infrared