1. Hot air convection heating in the top and bottom central areas.
2. Fully simulating the SMT reflow soldering heating temperature and programmable in adjustment.
3. Three-axis precision motion of QUICK robot platform structure and programmable moving position.
4. QUICK cycle heating temperature control system, real-time monitoring of heating temperature, safe and efficient.
5. Multiple specifications of solder removal heads and glue removal heads optional.
Power supply 220 V AC 50 Hz
General power 2600 W (Max)
Top hot air heating power 1200 W (Max)
Bottom preheating power 1200 W (Max)
Max. PCB size 300 mm* 350 mm (Max)
Heating movement stroke 350 mm* 400 mm (Max)
Movement accuracy ± 0.02 mm
Weight About 135 kg
Overall dimensions (L *W *H) 800 * 760 * 1030 mm