Turing L256 Uncooled Infrared Module (Temperature Measurement)
Turing L256 uncooled infrared module is equipped with an advanced 256×192 wafer detector with a dimension of 18×18mm. Thanks to its integrated design, it redefines standards in weight, dimension and power consumption (SWaP³) in the OEM module industry. As the best choice for low-cost solutions, it can be used in many fields such as industry, power, security, and machine vision.
Compatibility Design
• Its resolution is 256×192 and dimension is 18mm×18mm, which are consistent with those of the L384 mechanical interface for compatibility design.
Excellent Performance
• -20°C~+550°C wide measurement range to satisfy application requirements in different scenarios.
Multiple Selections
• The FOV is 20°~90° and the extension supports DVP/USB.