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Wet wafer etching machine

Wet wafer etching machine - RENA Technologies GmbH
Wet wafer etching machine - RENA Technologies GmbH
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Characteristics

Type
wet

Description

RENA’s wet etching tool for caustic or acidic applications is built to achieve outstanding surface results in semiconductor wafer production. Acidic etching combined with a fast transport system enables precise process control. For wafers up to 300 mm, this fully automated tool fulfills all requirements for high-end wafer production. On top, the carrier-less half-pitch processing capabilities guarantee highest throughput rates together with high yield. Our wafer etching platform is completely compliant to all SEMI-standards. Features and benefits Up to 300 mm wafer size Outstanding shape control Etch stop in under 1 second Perfect etch homogeneity Carrierless handling Half-pitch system for highest throughput Advanced process monitoring Multi-wafer transport to OHT loadport
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.