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Immersion wet bench Revolution
batchfor semiconductorsfor wafers

Immersion wet bench - Revolution  - RENA Technologies GmbH - batch / for semiconductors / for wafers
Immersion wet bench - Revolution  - RENA Technologies GmbH - batch / for semiconductors / for wafers
Immersion wet bench - Revolution  - RENA Technologies GmbH - batch / for semiconductors / for wafers - image - 2
Immersion wet bench - Revolution  - RENA Technologies GmbH - batch / for semiconductors / for wafers - image - 3
Immersion wet bench - Revolution  - RENA Technologies GmbH - batch / for semiconductors / for wafers - image - 4
Immersion wet bench - Revolution  - RENA Technologies GmbH - batch / for semiconductors / for wafers - image - 5
Immersion wet bench - Revolution  - RENA Technologies GmbH - batch / for semiconductors / for wafers - image - 6
Immersion wet bench - Revolution  - RENA Technologies GmbH - batch / for semiconductors / for wafers - image - 7
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Characteristics

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batch, for semiconductors, for wafers, immersion

Description

For multi-step semiconductor wet chemical processes, RENA offers flexible and compact semi-automated wet bench, the “Revolution”. This platform consists of a robust integrated central rotary robot and up to 5 process tanks located around the robot. The “Revolution” is the most ideal, minimal foot print and low cost solution for applications that require multi-step sequence of processes. It provides surface treatment of semiconductor wafers including etching, cleaning and resist stripping, both in FEoL and BEoL applications. The “Revolution” delivers superior process control and monitoring achieved by employing IDX Flexware software. The IDX Flexware offers advantageous features and capabilities. Based on the customer requirements, specialized process tank configurations e.g. patented metal etching and metal lift-off tanks, can be incorporated into this chemical station. For dry-to-dry processes, the patented Genesis Marangoni dryers can be integrated. All RENA systems are maintenance friendly and compliant to the SECS/GEM interface of factory host. Features and Benefits Dry-to-Dry Capabilities 100mm up to 200mm wafer sizes IDX Flexware Control Software Multi-Step Sequences Multiple Proprietary Technologies HMI Touchscreen Robust Rotary Robot SECS/GEM Interface Options Mini-environment as option Stainless-steel version for Solvent application Flexible and Upgradeable Tailored to Customer Specification Reduced Chemical & DI Water Usage Lower Facility Costs
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.