For multi-step semiconductor wet chemical processes, RENA offers flexible and compact semi-automated wet bench, the “Revolution”. This platform consists of a robust integrated central rotary robot and up to 5 process tanks located around the robot. The “Revolution” is the most ideal, minimal foot print and low cost solution for applications that require multi-step sequence of processes. It provides surface treatment of semiconductor wafers including etching, cleaning and resist stripping, both in FEoL and BEoL applications.
The “Revolution” delivers superior process control and monitoring achieved by employing IDX Flexware software. The IDX Flexware offers advantageous features and capabilities. Based on the customer requirements, specialized process tank configurations e.g. patented metal etching and metal lift-off tanks, can be incorporated into this chemical station. For dry-to-dry processes, the patented Genesis Marangoni dryers can be integrated.
All RENA systems are maintenance friendly and compliant to the SECS/GEM interface of factory host.
Features and Benefits
Dry-to-Dry Capabilities
100mm up to 200mm wafer sizes
IDX Flexware Control Software
Multi-Step Sequences
Multiple Proprietary Technologies
HMI Touchscreen
Robust Rotary Robot
SECS/GEM Interface Options
Mini-environment as option
Stainless-steel version for Solvent application
Flexible and Upgradeable
Tailored to Customer Specification
Reduced Chemical & DI Water Usage
Lower Facility Costs