Electrodeposition system EPM 2 series

Highest flexibility is required for pure metal and alloy deposition in the Microelectronic, Optoelectronic & Photonic chips market and its wide range of plating applications. The EMP 2 is a compact electro-plating system for semiconductor device manufacturing and packaging applications, such as UBM, Bumping, Cu pillars, TSVs, Blind vias, RDL, Micro Forming and more. Homogeneous deposition at highest plating rates is ensured by optimized electrolyte flow and electrical field control in the fountain system. The plating tool operates manually and can be installed in R&D environments as well as in small scale production. Flexibility for a wide range of applications The RENA EPM 2 system was designed to be integrated easily into research and institute environments as well as production facilities with a focus on very small-scale production. The low floor space, modular design, and option to add on extra process modules for pre-treating, etching, and drying guarantee the flexibility customers expect when it comes to electroplating. RENA is a strong partner for electrochemical deposition applications for the device manufacturing for optoelectronic, microelectronic devices and Photonic Chips in the semiconductor business. Wafer sizes from 2 to 8 inch are feasible in our tools, further substrate sizes and geometries are possible. Depending on the application requirements different plating technologies such as vertical rack, fountain, cup and fully customized plating can be applied. Overview of RENA EPM 2 system benefits Flexibility Different substrate sizes Adjustable wafer thickness Wide range of materials Flexible recipe management