The RENA InOxSide® 3 automated processing equipment is designed as an integrated solution for edge isolation, rear side polishing and doped glass removal of silicon solar cells. Using the process for lowest cost of ownership and best performance, the InOxSide® technology is the best choice for fabrication of Al-BSF, PERC and PERT silicon solar cells. It is based upon the RENA NIAK inline platform.
Features and Benefits
Fully automated wet chemical single side etching in an inline type process on 5/6 lanes
Single side emitter etching, rear side polishing and removal of doped glasses (PSG/BSG)
Uses HF/HNO3/H2SO4 for single side etching yielding the best-in-class Cost of Ownership (CoO)
RENA patented technology
Adjustable rear side etching: 1 to 5 µm, up to 6 µm with RENA PreCon option)
Integrated rinsing and drying of wafer
Throughput up to 6000 wafer/hour
Compatible with M0, M1, M2, M4, M6 and M12 wafer size
Long bath lifetime due to feed-and-bleed function
Accurate dosing system for constant bath composition
Uses O-ring free roller design
Lowest breakage rate in industry
Based on RENA NIAK inline processing platform
High uptime
Easy maintenance
Options
MES interface (SECS/GEM)
Media cabinet for chemical supply
Waste pump station for chemical drain / waste water
Sensors for process control (e.g. pH, conductivity)
RENA RaPID (RENA anti-PID solution)