Solar cell processing line InPolySide® 3+

chemical

The InPolySide® 3+ provides superior rear side and edge etching for TOPCon applications. Poly-Si wrap around from LPCVD and PECVD is removed. With high throughput and full flexibility wafer size is the tool ready for the next generation of solar cells. Designed as a space saving one-tool solution, the InPolySide® covers pre-oxide etch, poly-etching, cleaning or glass etching and rinsing steps. No additional wafer handling is required. Areas of Application TopCon technology Upgrade from PERC possible Single side and edge etching of Poly-Si Features and benefits Edge etching for shunt-free TopCon cells Highly variable and well-known process, adaptable to customers demands: - Low CoO - N-Type cells - Selective emitter for all available kinds of types of Poly-Si (PECVD, LPCVD) Process patented by RENA Highly optimized hardware configuration and process settings 1-tool solution