InCellPlate® is RENA’s new inline equipment for direct plating of a Ni/Cu/Ag stack on silicon. Combined with laser ablation of the silicon nitride layer and subsequent inline anneal, it provides complete, screen-printing free front-side metallization for solar cell manufacturing.
Features and Benefits
Production tool - up to 5000 wafers/h
Solid plated metal conductors
Total CoO benefit up to 3.5 $Ct/cell
Contact adhesion equal to standard screen-printed cells
Module reliability confirmed by Fraunhofer ISE and industry Partners
Highly specialised machine development for plating technology based on proven platform
Efficiency increase up to 0.3 % by reduced shadowing and contacting of low emitter surface concentrations
Enables use of high ohmic homogeneous emitters
Homogeneous metal Distribution for lowest series resistance
Low water consumption through cascaded rinse
Validated on PERC, TopCon & BSF cells
Patented single side inline plating technology
Dry contacts (no need for contact-demetallization)
Reduced chemical drag out and CoO
No deterioration of Al rear side throug dry Wafer rear side
Technology partners
Innolas Solutions: Advanced laser ablating equipment
MacDermid Enthone: High performance plating chemistry