Epoxy putty 303 series
for the food industryunderwater

epoxy putty
epoxy putty
epoxy putty
epoxy putty
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Characteristics

Chemical composition
epoxy
Domain
for the food industry, underwater

Description

RESOLTECH 3030 AL / 3038 AL epoxy adhesive cures at room temperature and enables the bonding of materials that will be in contact with food. This epoxy adhesive will enable to bond and seal any surfaces with high chemical and mechanical resistance. Any size crack may be filled without any shrinkage. The product is not sensitive to moisture while hardening and may even be used underwater or at very low temperatures. Food Contact Certificate Works on all type of substrates (composite, steel, cement, wood) Room temperature curing Applicable in high humidity conditions TG (°C) 90 Gel time on 70 mL, 4cm at 23°C 23m

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