Epoxy resin ET 290 series

for electronic applications

ET 290 A/ET 290 B is a hot curing solvent free epoxy system formulated for the potting of electronic parts, especially when associated with porous insulating materials. The low viscosity enables to encapsulate materials with a thickness < 4mm. ET 290 A/ET 290 B shows excellent resistances to thermos-mechanical strains. Hot curing Low viscosity at 70°C Solvent-free Mix density 1.15 Mix viscosity (mPa.s) 900 Gel time on 70 mL, 4cm at 23°C 15m