Wafer metrology system XHEMIS EX-2000

XRR AND XRF METROLOGY TOOL FOR BLANKET WAFERS UP TO 200 mm Thickness, density, roughness and composition of films on blanket wafers This versatile X-ray metrology tool uses X-ray fluorescence (XRF) and X-ray reflectivity (XRR) for high-throughput non-destructive measurement of thickness and density of blanket wafers ranging from ultrathin single-layer films to multilayer stacks for process development and film quality control. DESIGNED FOR HIGH-VOLUME MANUFACTURING XHEMIS EX-2000 is designed for high-volume manufacturing of up to 200 mm wafers. Outstanding stage alignment before measurement enables quick and accurate measurement of a variety of wafer samples. The highly accurate stage control enables full-surface mapping measurements in a short time. USER-FRIENDLY DESIGNED TOOL When equipped with a transfer robot, XHEMIS EX-2000 can handle wafers automatically. AutoCal (an automatic calibration function) maintains constant tool conditions. User-friendly software makes tool operation and data analysis easy. This tool can be used for a variety of applications from research to production for quality control. Wide range of materials and applications Simultaneous evaluation of film thickness, density and roughness High-throughput wafer measurements Absolute results from XRR (no calibration standards required) Full-wafer mapping and high-speed measurements by XRF High resolution and precision covering thicknesses from Ångstroms to microns Accepts 200 mm, 150 mm, 125 mm and 100 mm wafers Available auto-calibration function