Chip photodiode array PA2100

Chip photodiode array - PA2100 - RLS
Chip photodiode array - PA2100 - RLS
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Description

technology. The photodiodes are passivated with silicon-nitride which acts as an antireflective layer. They are then bonded to the PCB and protected with transparent epoxy glue. The Array can be used in photovoltaic or photoconductive mode. Features Available in four different options Peak wavelength at 830 nm Benefits High responsitivity Low capacitance Suitable for SMT High reliability

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Exhibitions

Meet this supplier at the following exhibition(s):

Global Industrie 2025
Global Industrie 2025

11-14 Mar 2025 Lyon (France) Stand 1M47

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.