- Machine-tools
- Finishing Machine
- Texturing machine
- RoboTechnik Intelligent Technology Co., Ltd.
Wafer texturing machine RCL-8000/16000
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Characteristics
- Applications
- for wafers
Description
Throughput: 8000-16000 wafer/hour
Breakage rate: ≤0.02% (for silicon wafers above M10 size)
Uptime: >98%
Characteristics:
Rear side clean for TOPCon, BC, HJT high-efficiency solar cells
PSG/BSG removal
Excellent uniformity, long bath lifetime
High throughput, Low CoO
Quick bath change, Inline bath change
Intelligent equipment, energy consumption statistics and analysis function
Workmanship:
Suitable for 156-220mm silicon wafers
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