- Machine-tools
- Finishing Machine
- Silicon polishing machine
- RoboTechnik Intelligent Technology Co., Ltd.
Silicon polishing machine TX-V12000/16000industrialsurface
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Characteristics
- Machined material
- silicon
- Domain
- industrial
- Other characteristics
- surface
Description
Throughput: 12000-16000 wafer/hour
Breakage rate: M10<0.01%/M1298%
Characteristics:
Alkaline polish for TOPCon, BC, HJT high-efficiency solar cells
Used for polishing, etching and cleaning treatment
Nano-bubble cleaning to achieve efficient cleaning of the surface of silicon wafer
With dry clean area and self-cleaning system
Avoid cross-contamination and reaction overtime
Upgrade related materials to avoid precipitation of impurities
Suitable with MES and RFID function
Intelligent equipment, energy consumption statistics and analysis function
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.