Winding machine CB-V12000/16000

Throughput: 12000-16000 wafer/hour Breakage rate: M10≤0.01%/M12≤0.02 Uptime: ≥98% Characteristics: Winding removal for TOPCon, BC, HJT high-efficiency solar cells Nano-bubble cleaning to achieve efficient cleaning of the surface of silicon wafer With dry clean area and self-cleaning system Avoid cross-contamination and reaction overtime Upgrade related materials to avoid precipitation of impurities Suitable with MES and RFID function Intelligent equipment, energy consumption statistics and analysis function