- Industrial machines and equipment
- Surface Treatment Equipment
- Dry cleaning machine
- RoboTechnik Intelligent Technology Co., Ltd.
Dry cleaning machine Optiwetfor waferswet processingetching
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Characteristics
- Technology
- dry
- Applications
- for wafers
- Other characteristics
- wet processing, etching
Description
Wet processing of wafer / substrates / masks
Cleaning, Developing, Striping, Etching, various chemical Processes incl. Piranha, HF, SC1 and SC2, Megasonic and Highpressure
Stand alone and wet bench version
Max. wafer size:Ø 12“ (Ø 300 mm) / Ø 600 mm / Ø 750 mm
Customised chucks
200 programmable recipes
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Semiconductor
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.