Fully automated micro cluster system for process stations, e.g.
Stripping
Spin coater
Developer
Lift-Off
Hot, cool and primer plates
UV baking
Max. wafer size: Ø 6“~ Ø 8“ ((Ø 150 ~ Ø 200 mm)
Max. substrate size: 6“ x 6“ (150 mm x 150 mm
Modular design for up to 6 process stations`