Selective Soldering System Orissa Fusion
Ths new Fusion Series combines High Speed Selective Soldering with high Flexibility at a small footprint. Orissa Fusion can be configured to Customer Needs. All available modules such as Fluxing, Top- and Bottom Side Preheating and different Soldering Modules can be arranged for differnent applications tp optimise utilisation of the Liine. 3 different Soldering Stations and 5 combinations for Preheating are available. Customers can choose Single Point Soldernozzles, Multi-Dip-soldernozzles, Jet-Wave and customised Soldernozzles. For conventional Wave Soldering, we offer an up to 150 mm wide Solderwave-Nozzle to be integrated in any Orissa Fusion.
Features
Configurable with mit 2 to 4 Processmdoules für Fluxing, Soldering and Pre-Heating
Various Heating Options: Top-side Prehast, Bottom-Side Pre-Heat
Closed-Loop Heatcontrol by Pyrometer or Thermo-Couple
Inline Transport with fully automatic adjustment of PCB-width
VHandling of Board sizes up to 610 mm x 610 mm (optional up to 1220 x 610 mm)
High Precision thanks to the automatic Board Aligment via Fiducial Mark Correction
Offline Programming by use of Gerber-Data or with the Build-In Teach-Camera
Modulare and easy to Exchange Solderpots
Automatic Solderlevel Detection and Solder-Feed