Wafer texturing machine SC-CSZ12000F-16G

Used for texturing& cleaning of mono crystalline wafers. Process Flow: Saw damage removal→Pre-cleaning→Mono-texturing→Post-cleaning/O3 cleaning→Acid cleaning→Hot water drying→Drying (for reference only) • Throughput:600pcs/batch,12000pcs/h——210 wafer(100pcs cassette),720pcs/batch,15000pcs/h——182 wafer(120pcs cassette). • Process bath circulation volume adjustable. • Uniform pyramids texture, etch depth adjustable. • With clean dry area and self-clean dry system. • Low H2O2 consumption. • Quick inline bath change. • Available with MES, RFID system, inline weight testing optional.