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ALD deposition machine PD-520 seriesthin-film
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Characteristics
- Method
- ALD
- Deposition type
- thin-film
Description
AlO+SiN Thin-film Deposition.
• Atomic layer deposition process, with better film uniformity.
• Multi-layer thin film deposited in the same process equipment or same furnace tube, reducing process steps and wafer breakage rate, improving yield effectively.
• Independent R&D of liquid source precursor vapor delivery and precursor rapid switching technology.
• Suitable for deposition of passivation layer for different precursors and materials, with a large space for process expansion.
Other S.C New Energy Technology Corporation products
Horizontal Furnaces Series
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.