3D inspection machine 3D-AOI 3Di Series

PCBfor the electronics industryhigh-resolution

To handle today’s rapidly changing market trends, the system can handle complex inspection challenges such as high component mounting density areas containing highly miniaturized parts placed near much larger and taller component. With our new 3D AOI system, you can strengthen quality assurance and increase production efficiency. The newly developed high-resolution camera system ensures a sharply focused image and provides enhanced inspection resolution for tiny components such 0402mm or 0201mm SMD chips, fine-pitch ICs and closely located pads. Saki's team of optical-inspection experts handles all software development in-house. This ensures optimal interactions and coordination with the various hardware subsystems, achieving the industry's fastest cycle time. Image capture, processing and inspection algorithms are executed in parallel, minimizing waiting times. Saki's unique soldering inspection algorithm improves pass/fail inspection accuracy by assessing both soldering fillet shape and wetting height.