Board-to-board connector Z-Ray® seriesSMTlow-profilepress-fit
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Characteristics
- Format
- board-to-board, SMT
- Shape
- low-profile
- Connection type
- press-fit
- Electrical characteristics
- high-density
- Product applications
- board
- Other characteristics
- rugged, high-speed, custom, micro
- Pitch
1 mm
(0.039 in)- Data rate
28 GB/s
Description
Z-Ray® micro array interposers are ultra-low profile, high density, highly customizable solutions for board-to-board, IC-to-board, and cable-to-board applications.BeCu micro-formed contacts, on 0.80 mm and 1.00 mm pitches, are available in a variety of standard and custom configurations, and in dual compression and single compression/solder ball designs. The contacts are assembled into rugged low profile FR4 substrate under high pressure and temperature.
Low Profile
Low profile 1 mm body height
Custom body height as low as 0.50 mm
High performance to 28+ Gbps
One piece design
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.