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Wafer polishing machine SC-CSZJ9600E-15F
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Characteristics
- Applications
- for wafers
Description
This equipment is used for polishing, etching and cleaning treatment of diffused wafers and also compatible for texturing and cleaning treatment of bifacial solar cells.
· Throughput: 400pcs/batch, 8000pcs/h.
· Compatible with rear side etch polishing and mono-crystalline rear side texturing process.
· Suitable for various additives.
· Wafer thickness down to 120um.
· With dry clean area and self-cleaning system.
· Quick inline bath change.
· Available with MES, RFID system, inline weight testing optional.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.