Al & Ag paste are printed on the surface of the wafer by screen printing technology,which becomes the positive & negative electrodes after drying and firing.
Loading→ Rear busbar printing →Drying→BSF printing→Front busbar printing→Drying→Front double printing→Drying &firing→Testing &Sorting
· CT:182mm, CT<1.0s ;210mm, CT<1.05s.
· Using high-speed rotary DD motor, with four paper reeling tables, it can quickly complete the wafer in /out action, and can achieve the turntable within 250ms.
· The squeegee head adopts the structure of direct-drive voice coil motor to realize real time pressure mode, which can realize real pressure monitoring.
· High precision camera alignment, independent intellectual property rights kinematics calibration algorithm, to achieve high-precision alignment.
· Automatic paste adding, automatic wet weight weighing, on-line printing quality monitoring (AOI) to realize loss control (optional).