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Dry cleaning equipement SC-CSZJ9600E-20Fwaterfor wafersprocess
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Characteristics
- Technology
- water, dry
- Applications
- process, for wafers
Description
Used for wrap around removal & cleaning of the diffused silicon wafers.
Process Flow
Wrap Around Removal→Post-clean→Acid Clean→Post-clean→Acid Clean→Hot Water Drying→Drying (for reference)
• Throughput: 400pcs/batch, 9600pcs/h(210mm wafer),480pcs/batch, 12000pcs/h (182mm wafer).
• Various additive technologies available.
• Wafer thickness down to 120μm.
• With dry clean area and self-cleaning system.
• Quick inline bath change.
• Available with MES, RFID system, inline weight testing optional.
Other S.C New Energy Technology Corporation products
Wet Chemical Equipment Series
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.